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ELECTRONICS
UV Curing of electronic assemblies offers the ability to cure within seconds, minimizing work-in-progress and while achieving results at room temperature.
Adhesives
The precision bonding of miniature parts offers heat-free activation of adhesives and greater throughput over time. The finished product is strong enough to be compared to spot welding, brazing and costly mechanical fasteners.
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Adhesive Products
Wire tacking, Surface Mount, Bonding - speakers, Die Attachments, Pin Attachments, Sealing/Gasketing, Flex Circuit Reinforcement/Relief, Ferrite Magnet Bonding, and Flip Chips
Coatings/Inks
The coating of small parts with UV inks provides protection (encapsulation, glob tops), strain relief, potting, masking and marking. Coating takes place in seconds, allowing for in-line testing, further assembly, minimizes handling, increases throughput and product life while eliminating the space and energy requirements of heat cures.
Coating/Ink Products
Printed Circuit boards, wires, computer chips, electronic components, cell phone OLED's, cell phone semiconductors, cables, ribbon cables, pins, smart cards, displays, video tape recorder, motors, disk drives.
MicroElectronics
Precision placement is critical in the semiconductor industry. The drive towards miniaturization has resulted in very tight tolerances in assembly. The precision and command provided by UV/Visible spot curing meets this requirement.
Light based technology provides safe (e.g. heat-free) activation of adhesives to tack or bond sensitive components and/or safe activation of encapsulants to seal and protect sensitive components and substrates. Microelectronic encapsulation using UV light enables fast curing, cure "on demand" upon exposure to UV light, encapsulation of rigid or flexible circuits while maintaining a low cost, compact curing system.
Electronic applications reap the benefits of UV curing whether in an automated or manual setting. Requiring neither drying time nor heat curing, applications such as circuit boards are immediately ready for soldering without the need for rack waiting.
Applications:
- Wire Tacking
- Encapsulation
- Strain Relief
- Potting
- Temporary Masking
- Conformal Coating Rework
- Surface Mount
- Bonding
- Die Attach
- Coating
- Pin Attachments
- Sealing/Gasketing
- Flex Circuit Reinforcement/Relief
- Ferrite Magnet Bonding
- Component Marking or Staking
- Glob Tops
- Flip Chips
End-Products:
- Printed Circuit Boards
- Wires
- Computer Chips
- Electronic Components
- Cables
- Ribbon Cables
- Pins
- Smart Cards
- Displays
- Video Tape Recorder
- Motors
- Disk Drives
Recommended/Suggested Products are:
Both Fusion UV and EXFO provide a range of products to suit this market, please refer to the supplier’s pages for appropriate solutions, or contact us and let us do the work for you! |
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